Work

An Alternative Junction-to-Case Thermal Resistance Test Method for High Power Press-Pack IGBTs

Year: 2024

Type: article

Source: IEEE Transactions on Power Electronics

DOI: 10.1109/tpel.2024.3452247

Authors: Hongyu Sun, Yuan Sun, Erping Deng, Yushan Zhao, Weibang Li, Maoyang Pan, Peng Liu, Yuxing Yan, Yongzhang Huang

Institutions: North China Electric Power University, State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, Hefei University of Technology, NARI Group (China)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDGs: Affordable and clean energy, Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G4741343074

OpenAlex ID: W4402040022

FWCI: 0.722

Cites: 24

Cited by: 7

Related to: 10