Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI)
Year: 2024
Type: article
Institutions: Georgia Institute of Technology, Microsoft (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402040079