Work

Modeling and Analysis of Parasitic Parameters of Through-Glass Vias With Various Tapers and Sidewall Roughness

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3452103

Authors: Zhen Fang, Jihua Zhang, Shuqi Li, Jinxu Liu, Libin Gao, Hongwei Chen, Xingzhou Cai, Wanli Zhang

Institutions: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Films and Integrated Devices

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Yunnan Key Research and Development Program

Award: G5809841437

OpenAlex ID: W4402040111

FWCI: 0.416

Cites: 21

Cited by: 4

Related to: 10