Work

Glass Package With Multiple Embedded Dies for mmWave Applications

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3453169

Authors: Xingchen Li, Xiaofan Jia, Joon Woo Kim, Serhat Erdogan, Kyoung-Sik Moon, Matthew B. Jordan, Madhavan Swaminathan

Institutions: Georgia Institute of Technology, Sandia National Laboratories, Pennsylvania State University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Sandia National Laboratories

OpenAlex ID: W4402126570

FWCI: 2.475

Cites:

Cited by: 24

Related to: 10