Work

Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3453597

Authors: Arifuzzaman Arif Sheikh, Edwin K. P. Chong, Steven J. Simske

Institution: Colorado State University

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4402127104

FWCI: 1.454

Cites: 23

Cited by: 7

Related to: 10