Failure Mechanism Investigations of Bond Wires Lifting-Off and Die-Attach Solder Aging Considering the Thermal Coupling Effects
Year: 2024
Type: article
Authors: Xinglai Ge, Ken Chen, Huimin Wang, Zhiliang Xu, Zhongjiang Fu
Institution: Southwest Jiaotong University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402159221