Work

The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3454166

Authors: Tianmeng Zhang, Jinchun Gao, Wenjia Wang, Ziren Wang, Chaoyi Wang, Ziyang Zhang

Institutions: Beijing University of Posts and Telecommunications, China Academy of Information and Communications Technology

Language: English

Topic: Electromagnetic Compatibility and Measurements

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, National Key Research and Development Program of China

Awards: G1557855520, G6940002817

OpenAlex ID: W4402187195

FWCI: 0.308

Cites: 29

Cited by: 3

Related to: 10