Innovating Semiconductor Packaging: Dynamic Finite Element Models and Steady-State Warpage Simulations
Year: 2024
Type: article
Authors: Mei-Ling Wu, Wei-Jhih Wong
Institution: National Sun Yat-sen University
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402262459