The Copper Connection: Hybrid Bonding is the 3D-Chip Tech That's Saving Moore's Law
Year: 2024
Type: article
Source: IEEE Spectrum
Author: Samuel K. Moore
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402301566