UCIe: Standard for an Open Chiplet Ecosystem
Year: 2024
Type: article
Source: IEEE Micro
Authors: Peter Onufryk, Swadesh Choudhary
Institution: Intel (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402303041