Work

Application of Cu Reflow Process on Ru Liner for Advanced Nanoscale Interconnects

Year: 2024

Type: article

Source: ECS Journal of Solid State Science and Technology

DOI: 10.1149/2162-8777/ad78fd

Authors: K. Motoyama, O. van der Straten

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4402397786

FWCI: 0.156

Cites: 15

Cited by: 2

Related to: 10