Work

New Tunable LED With Improved Heat Dissipation on Chip-on-Board

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3456768

Authors: J. C. Camacho-Arriaga, D. Cahue-Diaz, N. D. Herrera-Sandoval, J. A. Salazar-Torres, G. D. Conejo-Magaña

Institution: Instituto Tecnológico de Morelia

Language: English

Topic: GaN-based semiconductor devices and materials

Subfield: Condensed Matter Physics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: closed

Funder: Tecnológico Nacional de México

Awards: G6773763338, G89576153

OpenAlex ID: W4402401783

FWCI: 0.726

Cites: 22

Cited by: 5

Related to: 10