Work

Nanoscale Component Diffusion Study of InP/SiC Heterogeneous Bonding Interface for High-Quality Optoelectronic Device Integration

Year: 2024

Type: article

Source: ACS Applied Nano Materials

DOI: 10.1021/acsanm.4c03464

Authors: Ruyan Kang, Jian Zhou, Zehan Liu, Xiaoshan Wang, Xueyi Duan, Xiaoxuan Li, Jia Zhao, Zhiyuan Zuo

Institution: Shandong University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Shandong University, National Natural Science Foundation of China, National Key Research and Development Program of China

Awards: G3548643421, G360378399, G430285776, G7947385917

OpenAlex ID: W4402415862

FWCI: 0.833

Cites: 28

Cited by: 8

Related to: 10