Understanding the compaction behavior of uncured thermoset prepreg: Experimental investigation and theoretical analyses
Year: 2024
Type: article
Abstract: The deformation behavior of uncured thermoset prepreg during hot compaction process was investigated by dividing the whole compaction process into an initial compression stage and the subsequent creep stage. At the compression stage, there existed a strain‐softening phenomenon in the temperature range of 50–90°C, indicating different deformation behavior that is mainly determined by the viscosity of prepreg. Following an appraisal of advantages and limitations of existing compaction models, a combination model consisted of a modified power‐law model including the influence of temperature and the generalized Kelvin‐Voigt model was proposed to describe the deformation behavior of prepreg during compression and creep stage, respectively. Finally, a discussion on the compaction mechanism was conducted to offer some insights into the deformation process. Highlights Strain‐softening phenomenon occurred during the compaction of uncured prepreg. Proposed combination model captures the deformation of uncured prepreg well. The percolation mechanism dominates prepreg deformation during compaction. The squeeze flow mechanism causes limited thickness reduction of prepreg.
Source: Polymer Composites
DOI: 10.1002/pc.28995
Authors: Lei Yan, Bowen Gong, Shuyi Wang, Baofa Cheng, Cheng Sun, Wenting Ouyang, Huan Wang, Hua‐Xin Peng
Institution: Zhejiang University
Language: English
Topic: Epoxy Resin Curing Processes
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
Award: G4293070686
OpenAlex ID: W4402540372
