Work

Robustness of Large-Size Vacuum Sealed Packages for Microbolometer Array

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3462818

Authors: Hexin Xia, Hoang-Vu Nguyen, Avisek Roy, Per Ohlckers, Knut Eilif Aasmundtveit

Institution: University of South-Eastern Norway

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Norges Forskningsråd, Electronic Components and Systems for European Leadership

Awards: G115331517, G2612919513

OpenAlex ID: W4402557633

FWCI: 0.205

Cites: 25

Cited by: 2

Related to: 10