Work

Graphene-Based Absorptive Gasket for Chip Packages With Enhanced Radiation-Suppression and Heat-Dissipation Capabilities

Year: 2024

Type: article

Source: IEEE Transactions on Microwave Theory and Techniques

DOI: 10.1109/tmtt.2024.3455556

Authors: Zekai Luo, Tao Su, Kai-Da Xu

Institutions: Sun Yat-sen University, University of Electronic Science and Technology of China

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Science and Technology Program of Guizhou Province

Awards: G1466583807, G2759636656, G6477493225

OpenAlex ID: W4402570682

FWCI: 0.206

Cites: 41

Cited by: 2

Related to: 10