An Integrated Approach for Thermal Impact Based Reliability Analysis of Electronic Components
Year: 2024
Type: conference-paper
DOI: 10.4271/2024-28-0098
Authors: Shweta Mote, Shantaram Jadhav, Vijay Chaudhari, Aashay Mhaske
Language: English
Subfield: Safety, Risk, Reliability and Quality
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402627968