Work

Smaller Bond Pad for Device Reliability

Year: 2024

Type: conference-paper

Source: Symposium on Microelectronics Technology and Devices

DOI: 10.1109/sbmicro64348.2024.10673772

Authors: Ng Hong Seng, Lee Kuan Fang, Eddie Chaim Tau Tat, Florinna Sim, Jerald Sim Mong Joo, Deborah Debbie Anak Philip

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4402628490

FWCI:

Cites: 2

Cited by:

Related to: 10