Work

SF6/O2 plasma for ICP/RIE SiC Etching

Year: 2024

Type: conference-paper

Source: Symposium on Microelectronics Technology and Devices

DOI: 10.1109/sbmicro64348.2024.10673868

Authors: R. R. César, M. Mederos, F. H. Cioldin, R. M. Beraldo, R. C. Teixeira, R. A. Minamisawa, J. A. Diniz

Institutions: Centro de Tecnologia da Informação Renato Archer, FHNW University of Applied Sciences and Arts Northwestern Switzerland, Universidade Estadual de Campinas (UNICAMP)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4402629774

FWCI: 0.806

Cites: 23

Cited by: 1

Related to: 10