Work

Effect of Superfilling and Leveling Inhibitors in Hybrid Additives on the Microstructure Evolution of Electroplated Copper Interconnect Films during Self-Annealing

Year: 2024

Type: article

Source: Journal of The Electrochemical Society

DOI: 10.1149/1945-7111/ad7d3e

Authors: Silin Han, Mengyun Zhang, Yuhang Chen, Yunwen Wu, Ming Li, Tao Hang

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G6353188130, G862042367

OpenAlex ID: W4402631754

FWCI: 0.156

Cites: 31

Cited by: 2

Related to: 10