Comparison of copper-based composites fabricated by cross-accumulative roll bonding method for packaging design
Year: 2024
Type: article
Source: Materials Science and Technology
Authors: Yaxin Wei, Duan Ran, Yashar Piri, Maryam Zandi, Ali Pashapour
Institutions: Hubei University of Technology, Golestan University
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402650317