Fracture Conductivity with Application of 3D Printing Technology
Year: 2024
Type: conference-paper
DOI: 10.2118/220760-ms
Authors: V. A. White, J. Colina Arias, Ding Zhu, A. D. Hill
Institution: Texas A&M University
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402668276
