Co-Design for Heterogeneous Integration: High Level Decisions to the Rescue
Year: 2024
Type: conference-paper
Source: Conference proceedings
Institution: University of Maryland, College Park
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: National Science Foundation
OpenAlex ID: W4402702886