Opportunities, Challenges and Mitigations in 3DIC Design, Test, and Analyses
Year: 2024
Type: conference-paper
Source: Conference proceedings
Authors: Pratyush Kamal, Anthony Mastroianni, Juan Rey, Antonio De la Serna
Institution: Siemens (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4402727318