Work

Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3465655

Authors: Xianglong Wang, Jing Huang, Dongdong Chen, Di Li, Yintang Yang

Institutions: Xidian University, Zhejiang Sci-Tech University, Zhejiang University of Science and Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: National Natural Science Foundation of China

Awards: G3943548046, G426303449

OpenAlex ID: W4402742572

FWCI: 0.821

Cites: 38

Cited by: 8

Related to: 10