Work

Chip-to-Antenna Plane Transmission Structure Design for Antenna in Package

Year: 2024

Type: conference-paper

Source: International Conference on Electronic Packaging Technology (ICEPT)

Authors: Yuting Tong, Sha Xu, Zhen Liu

Institution: Guangdong University of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4402743609

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Cites: 8

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Related to: 10