Work

Study on Secondary Release Mechanism of DC Relay Based on Circuit-Magnetic Field-Mechanical Coupling Calculation

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3466310

Authors: Wenhua Li, Yangyang Li, Jihui Gao, Ruzheng Pan, Zhengyuan Zhao

Institutions: Hebei University of Technology, Tianjin Agricultural University

Language: English

Topic: Electrical Contact Performance and Analysis

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Hebei Province Graduate Innovation Funding Project, Key Research and Development Program of Sichuan Province

Awards: G3296191534, G3901286952

OpenAlex ID: W4402744037

FWCI: 0.269

Cites: 8

Cited by: 2

Related to: 10