Work

Size Effect Between Micron-Silver Joint and Nano-Silver Joint in Die-Attached Interconnection

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3465872

Authors: He Gong, Yuting Yang, Hongcheng Wu, Xiangchen Chen, Yao Yao

Institutions: Changzhou Institute of Technology, Northwestern Polytechnical University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Jiangsu Province, Basic Research Program of Jiangsu Education Department, Major Basic Research Project of the Natural Science Foundation of the Jiangsu Higher Education Institutions

Awards: G4512028935, G6052878900, G6250700179, G8525613717

OpenAlex ID: W4402744039

FWCI: 0.208

Cites: 34

Cited by: 2

Related to: 10