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Gradient Corrosion-Resistant Copper Using Molecular Decomposable Ink from Recycling

Year: 2024

Type: article

Source: ACS Applied Electronic Materials

DOI: 10.1021/acsaelm.4c01259

Authors: Saurabh Khuje, Abdullah Islam, Long Zhu, Jun Zhang, Zhongxuan Wang, Thomas Parker, Jian Yu, Shenqiang Ren

Institutions: University of Maryland, College Park, DEVCOM Army Research Laboratory, United States Army Combat Capabilities Development Command

Language: English

Topic: Nanomaterials and Printing Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Army Research Laboratory

Award: G479841559

OpenAlex ID: W4402762974

FWCI:

Cites: 28

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Related to: 10