Work

A Thermal and Power Integrity Co-Optimization Framework for 2.5-D Integrated Microsystem

Year: 2024

Type: article

Source: IEEE Transactions on Circuits and Systems I Regular Papers

DOI: 10.1109/tcsi.2024.3454628

Authors: Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao

Institution: Hangzhou Dianzi University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Natural Science Foundation of Zhejiang Province

Awards: 射频集成微系统智能设计方法研究, G2590409249, G3975477152

OpenAlex ID: W4402773194

FWCI: 1.35

Cites: 57

Cited by: 13

Related to: 10