Work

Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly

Year: 2024

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-04-2024-0020

Authors: Rilwan Kayode Apalowo, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Aizat Abas, Fakhrozi Che Ani

Institutions: Universiti Sains Malaysia, Federal University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4402884001

FWCI:

Cites: 34

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Related to: 10