Work

Comprehensive Analysis and Application of Laser Bonding Technology for Glass-Based Integrated Sensors

Year: 2024

Type: article

Source: IEEE Sensors Journal

DOI: 10.1109/jsen.2024.3465211

Authors: Zhen Fang, Jihua Zhang, Jinxu Liu, Juefeng Fu, Xiaobing Jili, Xingzhou Cai, Libin Gao, Hongwei Chen, Wanli Zhang

Institutions: University of Electronic Science and Technology of China, State Key Laboratory of Electronic Thin Films and Integrated Devices

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Yunnan Key Research and Development Program

Award: G5809841437

OpenAlex ID: W4402892071

FWCI: 0.104

Cites: 30

Cited by: 1

Related to: 10