Work

Research on temperature cycling reliability of BGA solder ball

Year: 2024

Type: conference-paper

Source: International Conference on Mechanical Engineering, Materials and Automation Technology (MMEAT)

DOI: 10.1117/12.3046632

Authors: Wenjun Sheng, Zhihai Wang

Institution: China Electronics Technology Group Corporation

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4402911835

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