Work

Thermal Characteristics Analysis and Optimization of Heterogeneous 2.5-D Package Under System-Level Conditions

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3467274

Authors: Meng-Kai Shih, Tang-Yuan Chen, Bing-Yuan Huang, Cheng-Tang Pan, Chen-Chao Wang, C. P. Hung

Institutions: National Sun Yat-sen University, Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Science and Technology Council

Award: G4594875000

OpenAlex ID: W4402916031

FWCI: 1.249

Cites: 31

Cited by: 12

Related to: 10