Work

High-Adhesion Epoxy-Based Solder Resist Dry Film for Integrated Circuits Enhanced by 2,2-Bis(hydroxymethyl)propionic Acid

Year: 2024

Type: article

Source: ACS Applied Polymer Materials

DOI: 10.1021/acsapm.4c02157

Authors: Jialin Zhang, Tao Wang, Xialei Lv, Shuye Zhang, Jinhui Li, Guoping Zhang, Rong Sun

Institutions: Chinese Academy of Sciences, Harbin Institute of Technology, Shenzhen Institutes of Advanced Technology, State Key Laboratory of Advanced Welding and Joining, Shenzhen Institute of Advanced Electronic Materials

Language: English

Topic: Epoxy Resin Curing Processes

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Science and Technology Foundation of Shenzhen City, National Natural Science Foundation of China, Natural Science Foundation of Heilongjiang Province, Basic and Applied Basic Research Foundation of Guangdong Province, Shenzhen Institutes of Advanced Technology Innovation Program for Excellent Young Researchers

Awards: G286847963, G4529848207, G6882749538, G6930384791, G6935520047, G8292638629, G8979790326

OpenAlex ID: W4402925110

FWCI: 0.677

Cites: 40

Cited by: 5

Related to: 10