Year: 2024
Type: article
Abstract: Reducing demands on a single chip by using smaller chips dedicated to specific functions.
Source: Communications of the ACM
DOI: 10.1145/3686310
Author: Gregory Mone
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4402985620