Transient Thermal Analysis of Chiplet-Based Systems with Dual-Channel Message Passing Neural Networks
Year: 2024
Type: conference-paper
Authors: Chenfei Li, Min Tang, Liang Chen
Institutions: Shanghai Jiao Tong University, Shanghai University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4403124195