Effects of hydrogen bonding and cross-linking on thermal conductivity of amorphous epoxy network
Year: 2024
Type: article
Abstract: The thermal conductivities of different epoxy resin formulations are investigated with two different measurement methods. Special attention is given to the concentration of H-atoms bonded to N- or O-atoms and the crosslink density. To investigate the influence of these variables independently, the stoichiometry of the resin formulation is varied. If the significant variables are separated a linear correlation can be observed with the thermal conductivity. A higher crosslink density and a higher concentration of H-atoms bonded to N- or O-atoms lead to a higher thermal conductivity. H-atoms bonded to O-atoms lead to a higher thermal conductivity then H-atoms bonded to N-atoms. • Functional groups that can form H-bonds increase the thermal conductivity. • Increasing crosslink density leads to higher thermal conductivity. • Different influences on the thermal conductivity can cancel each other out. • A higher mass density leads to a higher thermal conductivity.
Source: Materials Chemistry and Physics
Authors: Elias Chalwatzis, Frank Schönberger
Language: English
Subfield: Materials Chemistry
Field: Materials Science
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $2,990
OpenAlex ID: W4403140600