Work

Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN

Year: 2024

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-08-2024-0049

Authors: Calvin Ling, Cheng Kai Chew, Aizat Abas, Taufik Azahari

Institution: Universiti Sains Malaysia

Language: English

Topic: Industrial Vision Systems and Defect Detection

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403171130

FWCI:

Cites: 19

Cited by:

Related to: 10