Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded
Year: 2024
Type: article
Authors: Yangyang Lai, Atsushi Takahashi, Seungbae Park
Institutions: Binghamton University, Nagase (Japan)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4403183404