Work

Effect of pad size on shear strength and microstructure of LED solder joints

Year: 2024

Type: conference-paper

DOI: 10.1117/12.3045405

Authors: Zihao Jiang, Subin Wang, Ronghui Hong, Yingchao Xu, Weiping Zhu, Bo Liu, Zhifang Liu

Institution: Xiamen Institute of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403210053

FWCI:

Cites: 1

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Related to: 10