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Additive Manufacturing for 5G: Opportunities and Challenges

Year: 2024

Type: conference-paper

Source: International Conference on Electromagnetics in Advanced Applications (ICEAA)

DOI: 10.1109/iceaa61917.2024.10701657

Authors: Walter Zimbeck, Avinash Sharma, Avrami Rakovsky, Brian B. Gibbons

Institution: Johns Hopkins University Applied Physics Laboratory

Language: English

Topic: Additive Manufacturing and 3D Printing Technologies

Subfield: Automotive Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403211109

FWCI:

Cites: 2

Cited by:

Related to: 10