Impact of magnetic field variation on thermally annealed tantalum-filled vertical superconducting interconnects for scalable quantum computing systems
Year: 2024
Type: article
Abstract: Efforts to scale down advanced quantum processors with more numbers of qubits offer challenges since the integration of qubits is a significant obstacle in the path. Superconducting vertical interconnects in 3D IC integration can provide a crucial solution for wiring complexities, as shorter interconnections reduce energy loss when working in cryogenic conditions with better signal fidelity. Using the time-dependent Ginzburg–Landau equation, this simulation study analyzes vertical superconducting interconnects filled with materials like tantalum, niobium, and thermally annealed tantalum. It also investigates how London penetration depth (temperature-dependent) and magnetic fields affect Cooper pair density and, consequently, current density.
Source: APL Quantum
DOI: 10.1063/5.0196880
Institution: Indian Institute of Technology Hyderabad
Language: English
Subfield: Astronomy and Astrophysics
Field: Physics and Astronomy
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4403217322