Work

A Bond Wire Aging Monitoring Method for IGBT Modules Based on Bond Wire Degradation Voltage

Year: 2024

Type: article

Source: IEEE Journal of Emerging and Selected Topics in Power Electronics

DOI: 10.1109/jestpe.2024.3476374

Authors: Zongyuan Dai, Xinglai Ge, Chunxu Lin, Huimin Wang, Zhiliang Xu, Gengle Liang

Institution: Southwest Jiaotong University

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Natural Science Foundation of Sichuan Province

Award: G8068795979

OpenAlex ID: W4403278064

FWCI: 1.041

Cites: 31

Cited by: 10

Related to: 10