Preparation of Imidazole Compounds as Latent Curing Agents and Their Application in RGB LED Packaging
Year: 2024
Type: article
Abstract: LED packaging miniaturization has raised more requirements for LED materials. As a material contacting the LED chip directly, the reliability of LED non-conductive adhesive has also garnered increasing attention. This study optimized the formula for non-conductive adhesives for an imidazole curing system. The optimized composition of the adhesive is 25%wt for the curing agent and 30%wt for the silica. The prepared non-conductive adhesive has a 7-day pot life and 9-month storage stability. The shear strength reached 87 g and 72 g at 25 °C and 160 °C, respectively. The reliability of the LED modules packaged with the non-conductive adhesive was researched. The green and blue light intensity change was 4.7%, 43.7%, respectively, indicating good anti-aging properties. The blue light decay was mainly due to adhesive aging. The non-conductive adhesive effectively prevented "caterpillar" growth. This provides useful and practical guidelines for industry for applications of adhesive in different packages.
Source: Materials
DOI: 10.3390/ma17194935
Authors: Jiangcong Chen, Shujuan Zhang, Biwen Li, Pinghu Chen, Hengfeng Li
Institutions: Central South University, University of South China
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: gold
Estimated APC paid: $2,955
OpenAlex ID: W4403280549