Work

Cu–Cu Bonded Microbump Interconnects With a 10-μm Pitch for 3-D-Stacked Chiplets

Year: 2024

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2024.3469914

Authors: Zilin Wang, Ziqing Wang, Zheyao Wang

Institutions: Beijing National Research Center for Information Science and Technology, Tsinghua University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403332013

FWCI: 0.514

Cites: 42

Cited by: 5

Related to: 10