Work

Transmission line with flip-chip structure for high-frequency connection in optoelectronic chips

Year: 2024

Type: conference-paper

DOI: 10.1117/12.3035011

Authors: Keqi Cao, Xinyan Zhang, Wei Lin, Jia Chen, Hang Yu, Xiaonan Chen, Kunpeng Zhai, Jinhua Bai, Haiqing Yuan, Ninghua Zhu, Ming Li, Yu Liu

Institutions: Institute of Semiconductors, University of Chinese Academy of Sciences, Nankai University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403333195

FWCI:

Cites: 2

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Related to: 10