Work

The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3479928

Authors: T. M. Silva, L. S. Bezerra, G. M. Santos, A. R. Guarino, G. B. Loureiro, L. A. L. Basilio

Institution: Instituto de Pesquisas Eldorado

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4403390514

FWCI:

Cites: 40

Cited by:

Related to: 10