Study on the Electrothermal Properties of Cu-CNT TSV Interconnects Under Multiphysics Field Coupling
Year: 2024
Type: article
Authors: Canqing Li, Zhuoming Liang, Haihua Lu, Lanxian Cheng
Institution: South China Agricultural University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G231730782
OpenAlex ID: W4403390529