Work

Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications

Year: 2024

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2024.3480090

Authors: Shreya Dwarakanath, Pragna Bhaskar, Kimiyuki Kanno, Pratik C. Nimbalkar, Mohanalingam Kathaperumal, Markondeya Raj Pulugurtha, Madhavan Swaminathan, Rao R. Tummala

Institutions: Georgia Institute of Technology, JSR (Japan), Florida International University, Pennsylvania State University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403390540

FWCI: 0.389

Cites: 29

Cited by: 5

Related to: 10